TL;DR
Design and develop next-generation semiconductor equipment in Advanced Packaging.
- •Join ASM's Advanced Packaging team as a Principal/Senior Mechanical Engineer.
- •You will design and develop next-generation semiconductor equipment, working at the intersection of cutting-edge technology and engineering.
- •Key Responsibilities Contribute to the design and development of semiconductor systems.
- •Manage project timelines, budgets, and resources.
- •Provide technical support and troubleshooting for equipment and automation systems.
- •Own BOM release and maintenance, ensuring accurate documentation.
- •Act as a system-level technical expert, supporting complex semiconductor equipment.
- •Requirements Bachelor's, Master's or PhD degree in Engineering (Mechanical, Electrical, Chemical, Systems, or similar).
- •Experience in semiconductor equipment or complex technical environments.
- •Strong problem-solving mindset with system-level thinking.
- •Willingness to travel internationally (~25–50%).
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