Senior Principal Engineer, Mechanical Engineering, Advanced Packaging
AssemblyAdvanced Manufacturing company
Singapore, SingaporeLead
About the role
TL;DR
Design and develop next-generation semiconductor equipment in advanced packaging.
- •Join ASM's Advanced Packaging team as a Senior Principal Engineer, Mechanical Engineering.
- •You will design and develop next-generation semiconductor equipment, operating at the intersection of cutting-edge technology and engineering.
- •Key Responsibilities Contribute to the design and development of semiconductor systems, including equipment selection, process controls, and automation integration.
- •Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards.
- •Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.
- •Act as a system-level technical expert, supporting complex semiconductor equipment in both development labs and customer fabs.
- •Support new product introduction (NPI), including early builds, lab validation, and ramp to high-volume manufacturing.
- •Requirements Bachelor’s, Master’s or PhD degree in Engineering (Mechanical, Electrical, Chemical, Systems, or similar disciplines).
- •Experience in semiconductor equipment or complex technical environments.
- •Strong problem-solving mindset with system-level thinking.
- •Hands-on approach and ability to connect theory with real-world system behavior.
- •Willingness to travel internationally (~25–50%).