Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal
EliyanChiplet Interconnects company
Bay AreaSenior
Intel Capital
Tiger Global Management
Seligman Ventures
Cisco Investments
Lumentum
Micron
About the role
TL;DR
Develop thermal and electrical simulations for next-generation semiconductor packaging solutions.
- •Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team.
- •Key Responsibilities Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identification Execute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architectures Conduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL) Requirements PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered) Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging
Required skills
Python
Benefits & perks
fun work environment, excellent benefits
Tech stack
Python