Tech Lead, Payments

Architect and implement high-throughput, low-latency payment services in Go.

• •Architect and implement high-throughput, low-latency payment services in Go across fiat and blockchain-based flows.
• •Key Responsibilities Design greenfield distributed systems, including ledgering, settlement orchestration, reconciliation, and partner integration layers Build event-driven microservices using modern messaging systems and cloud-native patterns Define service boundaries, data models, and integration contracts across synchronous and asynchronous systems Establish engineering standards for reliability, observability, security, and performance across the Payments stack Collaborate cross-functionally with Product, Compliance, and Infrastructure teams to deliver secure, enterprise-grade payment capabilities Requirements 8+ years of backend engineering experience, including building high-availability, mission-critical financial or payment systems Strong production experience in Go, with deep understanding of concurrency, memory management, and performance optimization Proven experience designing distributed, event-driven architectures (e.g., Kafka or similar messaging systems) and microservices-based systems Experience integrating with payment rails (e.g., ACH, SEPA, card networks) and/or blockchain-based payment flows (wallets, custody, stablecoins) Strong understanding of cloud-native infrastructure (AWS and/or GCP), networking fundamentals, and containerized deployments (GCP preferred)