Optical - Director (+), Optical Product Development (OPD)
EliyanChiplet Interconnects company
Bay AreaDirector
Intel Capital
Tiger Global Management
Seligman Ventures
Cisco Investments
Lumentum
Micron
About the role
TL;DR
Define and execute optical product strategy for integrating third-party optical components with Eliyan's silicon die.
- •Eliyan is building NuLink, a proprietary die-to-die chiplet interconnect fabric purpose-built for AI infrastructure at hyperscale.
- •As Eliyan expands into co-packaged optics (CPO), the Director of Optical Product Development owns the product strategy for integrating third-party optical components with Eliyan's silicon die at the package level.
- •Key Responsibilities Define optical product strategy centered on die-level co-packaging of external optical components with Eliyan's silicon.
- •Own the optical component selection and qualification process, evaluating vendors against system performance and assembly compatibility requirements.
- •Drive assembly-aware optical product specifications, accounting for flip-chip tolerances, solder reflow constraints, alignment accuracy, and packaging design rules.
- •Engage silicon process and design teams, translating optical requirements into process-compatible constraints and vice versa.
- •Navigate optical-electrical co-design tradeoffs within foundry process boundaries.
- •Serve as the primary interface between optical and silicon teams, ensuring bidirectional feed-in/feedback between optical integration requirements and silicon design.
- •Partner with Marketing to define product positioning, customer-facing optical specifications, and roadmap priorities.
- •Report execution status and product milestones to the COA.
- •Requirements 12+ years in optical systems or photonic integration, with substantial hands-on experience in semiconductor fabrication, assembly, or advanced packaging environments.
- •Solid working knowledge of semiconductor fabrication processes
- •FEOL/BEOL concepts, lithography constraints, metal layer stackups, and how process design rules affect optical integration feasibility.
- •Deep understanding of co-packaging architectures
- •flip-chip bonding, micro-bump interconnects, interposer-based integration, or equivalent.
- •Experience qualifying and integrating third-party optical components (VCSELs, PDs, optical subassemblies) into semiconductor packages.
- •Familiarity with packaging design rules and their implications for optical alignment yield.
- •Experience navigating optical-electrical co-design tradeoffs within foundry process boundaries.
- •Strong cross-functional communication skills across silicon, packaging, and marketing teams.
- •Standards-body experience (IEEE 802.3, OIF, CPO Consortium) a plus.
Domain expertise
fintech